BGA Rework System

Product Description

BGA Rework System

Specification:

Total power: 2800W

Top heater: 800W

Bottom heater: 2000W

Power supply: single-phase 220V AC

                        50/60HZ 3KVA5

Machine dimension: L450×W380×H580

thermocouple Temperature control: High-precision K-type 

Locating way: V jig, applicable

                       max PCB size 300×320mm

Machine weight: approx. 25Kg

Descriptions:

1. Use high-precision import material(temperature control instrument, PLC , heaters),can control Soldering / De-soldering process precisely

    

2. The heaters (upper/lower heater) heating independently, 8 segments of temperature up and 8 segments of constant temperature control, can store 10 groups of temperature curves

    

3. High-precision import thermocouple, carry out the precise temperature measurement.

    

4. The separate temperature display of the upper and lower heaters, cross flow fan can cool the lower heating area rapidly and protect PCB from deformation during de-soldering.

    

5. Buzz after soldering or de-soldering is finished, vacuum pen available for removing BGA.

    

6. V-type neck used for locating PCB, flexible, movable and versatile clamps to protect PCB.

    

7. Can easily handle PCB with big heat capacity, other high temperature requirement, or lead free soldering